Structue and strength of fine-grain copper after cryorolling and single electr?-pulsing of different capacity

The effect of a treatment combining isothermal cryogenic rolling and single electro-pulsing on the structure hardness M1 grade copper with an initial grain size 10 –15 ?m was investigated. Copper deformed at liquid nitrogen temperature by multi-pass total reduction 90 %. Subsequent electro-pulse (EPT) carried out in interval integral current densities (Kj) from 3.5 ×104 to 8.1×104 A2 s / mm4. Nearly two-fold strengthening Cu under found due formation heavily (sub)grain crystallite order 1 fraction high-angle boundaries about 30 With further EPT energy A2s mm4, processes recovery predominantly occur, resulting slight softening simultaneous strong decrease micro-distortions crystal lattice dislocation densities. Processing higher energies resulted sharp drop owing activation in-situ continuous static recrystallization, forming regions new fine defect-free grains, whose increased Kj, intensified annealing twins. As result Kj range 5×104 – 7×104 uniform fine-grained near 2 %, third part which were twins ?3, obtained. increase pulsing normal growth 4 minor changes angular parameters observed. nature structural mechanical behavior is discussed. A conclusion made viability use combination manufacture ultrafine- fine-grain sheets different strength copper.